半导体器件原理与技术（Semiconductor Device Principle and Technology）

定　　价：79 元

• 作者：文常保
• 出版时间：2023/1/1
• ISBN：9787560666204
• 出 版 社：西安电子科技大学出版社

• 中图法分类：TN303 
• 纸张：胶版纸
• 开本：16开

内容简介

This book comprehensively and deeply introduces the semiconductor device principle and technology. The book consists of three sections: semiconductor physics and devices, semiconductor manufacturing process and semiconductor device packaging and testing. The first section mainly introduces semiconductor physics foundation, diode, bipolar transistor, MOS field effect transistor, power MOSFET, thyristor, IGBT, passive device and SPICE model. The second section mainly introduces semiconductor process technology, semiconductor process simulation and thin film preparation technology. The third section mainly introduces semiconductor packaging, testing and simulating technology. These contents will lay a solid foundation for further mastering the basic theories and methods of analysis, design, manufacturing, packaging and testing of semiconductor devices.
This book can be used as a textbook for undergraduate and graduate students who are engaged in the analysis, design, manufacturing, packaging, testing and simulating of semiconductor devices and IC design. It can also be used as a self-study and reference book for professional engineers.
本书全面、深入地介绍了半导体器件的原理和技术。本书包括三个部分:半导体物理和器件，半导体制造过程和半导体器件包装和测试。第一部分主要介绍半导体物理基础、二极管、双极晶体管、MOS场效应晶体管、功率MOSFET、晶闸管、IGBT、无源器件和SPICE模型。第二部分主要介绍半导体工艺技术、半导体工艺模拟和薄膜制备技术。第三部分主要介绍半导体封装、测试与模拟技术。这些内容将为进一步掌握半导体器件的分析、设计、制造、封装和测试的基本理论和方法奠定坚实的基础。

本书可作为从事半导体器件分析、设计、制造、封装、测试、模拟和集成电路设计的本科和研究生教材，也可作为专业工程师的自学和参考书。